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DUROSTONE®
PCB SOLDER
PALLET MATERIALS
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Technical Data in ENGLISH units
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- Durostone®
materials have excellent mechanical properties at elevated
temperatures.
- All materials are dimensionally
stable and retain their flatness through repeated
cycling in the PCB assembly process.
- The low thermal conductivity of
Durostone® ensures
optimal thermal distribution
across the PCB.
- The resin system used in
Durostone provides resistance to the chemicals used in
fluxes and also prevents solder pick-up.
- PCB assembly tooling can be
manufactured to fine tolerances with Durostone®
materials.
- The materials are easier to
handle in the production process than most others used for
PCB tooling due to two factors,
1. The density, which helps to reduce the weight of the
finished tooling.
2. The glass and resin content, which ensures that the line
operators and the machinists are not
subjected to skin irritation, alleviating
any health & safety concerns.
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NOTE:
The three grades listed above are the standard grades suitable for
use in the majority of applications in the PCB assembly process.
In certain cases where high volume assembly is carried out with a
solder pallet return cycle time of less than 30 minutes and fluxes
containing either a) halides or b) >97% alcohol, then
degradation of the resin may occur.
In this situation the grade developed to withstand resin breakdown
should be used. Please refer to our data sheet on Durostone®
CCR-766.
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DUROSTONE
CCR766
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