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Durostone® has proven
successful in all aspects
of the SMT assembly process.
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It can be machined to the tolerances
required for
accurate SMT placement and retains its flatness
through continued cycling in reflow ovens.
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The low thermal conductivity of the
materials prevents
heat sinking from the PCB, ensuring adequate reflow
of the solder paste.
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Durostone® materials can be
used for the following
applications in the SMT assembly process.
- Solder Paste Printing
- SMT Placement
- Reflow
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SMT pallets manufactured in Durostone
can
- Support thin or flexible PCB's.
- Allow processing of odd-shaped
boards.
- Increase line throughput by
carrying multiple PCBs.
- Prevent bowing of the PCB during
reflow.
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