SMT Assembly
 

Durostone® has proven successful in all aspects 
of the SMT assembly process. 

It can be machined to the tolerances required for 
accurate SMT placement and retains its flatness 
through continued cycling in reflow ovens. 

The low thermal conductivity of the materials prevents 
heat sinking from the PCB, ensuring adequate reflow 
of the solder paste.
Durostone® materials can be used for the following 
applications in the SMT assembly process.
  • Solder Paste Printing
  • SMT Placement
  • Reflow
 

SMT pallets manufactured in Durostone can
  • Support thin or flexible PCB's.
  • Allow processing of odd-shaped boards.
  • Increase line throughput by carrying multiple PCBs.
  • Prevent bowing of the PCB during reflow.
     
 
 

Röchling Permali Composites S.A.S.
is a subsidiary of

Röchling Engineering Plastics KG
Haren, Germany

 




Röchling Permali Composites SA
8 rue Andre Fruchard, B.P.12, Maxéville
54527 LAXOU Cedex 
FRANCE

Tel. +33 (0)3 83 34 24 24     Fax  +33 (0)3 83 32 23 18

 

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