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Composite materials for the PCB assembly industry


Durostone® solder pallet materials have been specifically developed for the PCB assembly industry for use as carriers in the wave solder and SMT processes.

There are three standard grades, Durostone® CHP760, CAS761 and CAG762.

 

For more information on Durostone® solder pallet materials please follow the link below to the old version of the solder pallet web site.

Lead Free Soldering :

Durostone® CLF770 is a new grade that has been developed for the extreme temperatures used in the lead free soldering process. Technical details regarding the material will follow shortly.

Download the brochure in PDF format below.


 

Durostone®-CLF770

Durostone CLF770
793 KB

 


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